Micro-Metallizer · Plating Pen

Nickel Plating Pen

Part no. PL-1006

Plate nickel over copper surfaces. Apply copper flash first on non-copper substrates. Essential underlayer for many plating sequences.

Deposit: Nickel
Plates onto: Copper
Prep / underlayer: Copper flash first on non-copper substrates

$70.00In stock · ships same day from NJ

Purchasing for a company? We accept POs and quote volume pricing —send a PO request or call (908) 526-8440.

Ships same day. Order by 2 PM ET on a business day and it leaves our Flemington, NJ facility that afternoon.

Returns accepted within 14 days of delivery. Contact us to start a return.

Overview

The Nickel Plating Pen is one of the most-used pens in the Micro-Metallizer system. Beyond standalone nickel plating, it serves as the standard underlayer that gives gold, rhodium, and other precious-metal platings the durable, well-bonded substrate they require.

Electrical contact restoration workflows (PL-1000C kit) typically apply nickel as an intermediate before the final gold layer. The same workflow is used for connector pin and edge-connector repair across electronics and aerospace MRO.

Apply over copper directly. For other substrates (steel, brass, etc.), apply a copper flash with the Copper Plating Pen first. Heavy-duty variant (PL-1020) available.

Specifications

Part No.	PL-1006
Metal	Nickel
Compatible Surfaces	Copper (apply copper flash on others)
Required Compatibles	Absorbent Pen, Power Supply, Connector Cables
System	Micro-Metallizer
Shipping weight	45 g
Package (L × W × H)	18 × 3 × 3 cm