Brush & selective plating systems · Est. 1970 · Flemington, NJ(908) 526-8440hunter@hunterproducts.com

Documentation

Catalog · 116 KB

Micro-Metallizer Catalog

Complete reference for the Micro-Metallizer plating pen line — every standard and heavy-duty pen, kits, accessories, and the application process for each metal.

Brochure · 1.7 MB

Carbitron 300 Brochure

In-depth brochure for the Carbitron 300 tungsten-carbide diamond-dusting system. Specifications, application examples and operating guidance.

On request

Safety Data Sheets

Current SDS for any Hunter plating solution or Carbitron consumable, sent by email.

Brush plating FAQ

Common process questions.

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Q01What is brush plating?

Brush plating (selective or spot plating) deposits metal only where it is needed. The solution is held in an absorbent tip on the positive lead of a DC supply; the part is connected to the negative. No tank or immersion is required.

Q02What is a copper flash, and when do I need one?

A thin copper layer applied first so the next metal has a compatible base. Nickel, black nickel, chrome-color and rhodium pens plate over copper — on non-copper substrates, apply a copper flash first.

Q03Why plate nickel under gold or rhodium?

Nickel is the standard underlayer for gold, rhodium and other precious-metal finishes. Rhodium plates over nickel; on non-copper parts the sequence is copper flash → nickel → rhodium.

Q04Can I plate stainless steel?

Yes, with the correct prep. The standard Absorbent / Degreaser pen does not work on stainless — use the Stainless Steel Degreaser Pen (PL-1014) before any plating step.

Q05Can I plate aluminum or chromium?

Copper, silver, tin and zinc pens are not for aluminum or chromium surfaces. Contact us to discuss your substrate before ordering.

Q06Standard or heavy-duty pen?

Heavy-duty pens hold more plating volume per cartridge and are intended for thicker deposits, larger areas and high-wear surfaces. Standard pens suit spot work and lighter deposits.