Carbitron 300 System
Professional tungsten carbide coating system. The original diamond dusting platform for medical instruments, tooling, and industrial applications.
Professional tungsten carbide coating system. The original diamond dusting platform for medical instruments, tooling, and industrial applications.
Precision micro-abrasive blasting for cleaning, etching, and surface preparation on small or delicate components.
The most complete pen plating kit available. Covers the full range: Absorbent, Nickel, Gold 24K, Silver, Chrome Color, and Copper.
Premium heavy-duty complete kit. Silver-Heavy, Copper-Heavy, Gold 24K-Heavy, Nickel-Heavy, Rhodium, and Absorbent pens included.
Complete repair kit for electronic component restoration. Includes power supply, connector cables, Absorbent, Nickel, and 24K Gold pen.
Heavy-duty version for thicker substrates. Includes HD power supply, cables, and heavy-duty Absorbent, Nickel, and Gold pens.
Essential first step in any plating process. Cleans and degreases all metal surfaces (except stainless steel) before plating.
Specialized degreaser for stainless steel surfaces prior to plating. Standard degreaser cannot prep stainless — this is the correct solution.
Plate pure 24-karat gold onto gold, nickel, or silver surfaces. Ideal for electrical contacts, jewelry repair, and decorative work.
Plate 18K gold for jewelry and decorative applications where a warmer tone is preferred over 24K.
Plate 14K gold over gold, silver, or nickel surfaces — the most popular karat for jewelry applications.
Plate nickel over copper surfaces. Apply copper flash first on non-copper substrates. Essential underlayer for many plating sequences.
Deposit black nickel for decorative and functional applications. Apply copper flash first on non-copper surfaces.
Plate silver onto any metallic surface except aluminum or chromium. Common for electrical contacts, silverware restoration, and jewelry.
Apply a chrome-colored finish over copper. Apply copper flash first on non-copper surfaces.
Plate copper over any metallic surface (not aluminum or chromium). Used as an intermediate flash layer for other platings.
Premium rhodium plating for the hardest, most reflective finish available. Plate over nickel — apply copper flash and nickel first on non-copper surfaces.
Plate tin over any metallic surface (not aluminum or chromium). Widely used in electronics for solderability enhancement.
Plate zinc over metallic surfaces for corrosion protection and galvanic applications (not aluminum or chromium).
Plate palladium for corrosion-resistant, tarnish-proof finishes. Widely used in electronics and fine jewelry as a white-metal alternative to rhodium.
Heavy-duty 24K gold pen for thicker gold deposits on high-wear surfaces. Greater plating volume per cartridge than the standard pen.
Heavy-duty 18K gold pen for thicker deposits. Ideal for high-contact jewelry and industrial components requiring a durable gold finish.
Heavy-duty silver pen for thicker silver deposits on electrical contacts, silverware restoration, and large surface jewelry work.
Heavy-duty copper pen for thick copper plating and buildup applications. Ideal as a heavy flash layer on large industrial parts.
Heavy-duty nickel pen for thick nickel deposits. Used as a heavy underlayer for gold, rhodium, and other precious metal platings.
Replacement connector cables for attaching Micro-Metallizer pens to the power supply.
Variable DC power supply, 110V/60Hz or 220V/50Hz. Drives all Micro-Metallizer plating pens.
Standard 1/8" × 2½" tungsten-carbide electrode for the Carbitron 300 system. Supplied with the system; used for general-purpose deposition.
Fine 1/16" × 2½" tungsten-carbide electrode for the Carbitron 300 system. Supplied with the system; used for finer work on smaller surfaces.
Precision 1/32" × 2½" tungsten-carbide electrode for the Carbitron 300 system. For precision applications on small or delicate surfaces.
No products match. Ask us — we may have a configuration that fits.